SMT assembly processes, particularly reflow soldering, can be energy-intensive. However, advancements in equipment design and process optimization have led to more energy-efficient SMT assembly lines. Modern reflow ovens and other machinery are designed to minimize energy consumption while maintaining precise process control, reducing the overall environmental footprint of SMT manufacturing.
3D Packaging and Through Silicon Via (TSV) Technologies: Future electronic device development is expected to be strongly influenced by through-silicon-via technology, a type of vertical interconnect access (VIA) connection used in IC packaging to provide vertical electrical connections between silicon wafers or dies. TSV technology establishes electrical contact with surface-mounted devices while mirrored sidewalls enhance package reflectivity and improve light efficiency.
Geographical Insights: APAC dominated the Surface Mount Technology (SMT) Equipment Market Share in 2023. North America is the second largest contributor to the global Surface Mount Technology (SMT) Equipment Market, followed by Europe, Middle East and Africa, and South America.
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